专利内容由知识产权出版社提供
专利名称：METHOD FOR PRODUCING LAMINATED
ELECTRONIC COMPONENT, ANDLAMINATED ELECTRONIC COMPONENT
发明人：Kazunari Kimura,Misaki Tabata,Shigemitsu
Tomaki,Akira Nakamura,Isao Abe,NoriyukiSaito
申请号：US13811167申请日：20110721
公开号：US20130266758A2公开日：20131010
专利附图：
摘要：A method of manufacturing a laminated electronic part includes fabricating firstand second laminated sheets by laminating an insulating function layer made of anunsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make uppart of circuit components; cutting the first and second laminated sheets into sticks tocreate a plurality of first and second laminate sticks; fabricating a third laminated sheetby rotating the second laminate sticks by 90°, arranging the second laminate sticks to beeach sandwiched between the first laminate sticks, and thermocompression bondingthem for integration; singulating the third laminated sheet into chips and creatingsintered bodies by sintering the unsintered chips to integrate the first laminate with thesecond laminate.
申请人：Kazunari Kimura,Misaki Tabata,Shigemitsu Tomaki,Akira Nakamura,IsaoAbe,Noriyuki Saito
地址：Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP
国籍：JP,JP,JP,JP,JP,JP
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