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专利名称：METHOD FOR EUTECTIC BONDING OF
WAFERS, AND A WAFER BOND
发明人：SCHMITZ, Volker,GROSSE, Axel申请号：EP17729054.1申请日：20170531公开号：EP34169A1公开日：20190410
摘要：The invention relates to a method for eutectic bonding of wafers comprisingthe steps: (a) providing a first wafer (10) comprising a first bonding layer (310), a secondwafer (20) comprising a second bonding layer (320) and a spacer (400), (b) placingtogether the first wafer (10) and the second wafer (20), the spacer (400) lying on the firstbonding layer (310). (c) pressing together the first wafer (10) and the second wafer (20)until the first bonding layer (310) lies against the second bonding layer (320), the spacer(400) penetrating the first bonding layer (310). (d) eutectic bonding of the first wafer (10)to the second wafer (20) by the formation of a eutectic alloy at least from portions of thefirst bonding layer (310) and the second bonding layer (320). The invention also relates toa eutectic bonded wafer bond and to a micromechanical device having a eutectic bondedwafer bond of this type.
申请人：Robert Bosch GmbH
地址：Postfach 30 02 20 70442 Stuttgart DE
国籍：DE
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