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专利名称：PLACING TABLE AND PLASMA PROCESSING
APPARATUS
发明人：Dai KITAGAWA申请号：US14730520申请日：20150604
公开号：US20150373783A1公开日：20151224
专利附图：
摘要：Provided is a placing table configured to place a workpiece thereon. The placingtable includes: an electrostatic chuck configured to attract the workpiece; a supportmember configured to support a focus ring; and a metal base having a first region
configured to support the electrostatic chuck and a second region configured to supportthe support member, the second region surrounding the first region. The supportmember includes: an intermediate layer formed of a ceramic sintered compact andsupported on the second region via an adhesive; a thermally sprayed ceramic layerformed on the intermediate layer by a thermal spraying method; and a heater electrodeprovided within the thermally sprayed ceramic layer. The heater electrode is formed bythe thermal spraying method.
申请人：TOKYO ELECTRON LIMITED
地址：Tokyo JP
国籍：JP
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