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专利名称：Ceramic substrate and manufacturing
method thereof
发明人：Nakamura, Yoshifumi,Bessho,
Yoshihiro,Yuhaku, Satoru,Hakotani,Yasuhiko,Itagaki, Minehiro,Miura, Kazuhiro
申请号：EP94101559.6申请日：19940202公开号：EP0609861A2公开日：19940810
专利附图：
摘要：The method of manufacturing a ceramic substrate having a plurality of bumps
of the present invention, includes the steps of: forming a bump forming layer having aplurality of holes therein on at least one of upper and lower faces of a laminated body ofgreen sheets; filling the holes in the bump forming layer with a bump forming paste;sintering the laminated body of the green sheets and the bump forming layer; andforming bumps made of the sintered bump forming paste by removing the bumpforming layer.
申请人：MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
地址：1006, Oaza Kadoma Kadoma-shi, Osaka-fu, 571 JP
国籍：JP
代理机构：Schwabe - Sandmair - Marx
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