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HEAT TREATMENT APPARATUS, HEAT TREATMENT METHOD, A

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专利名称:HEAT TREATMENT APPARATUS, HEAT

TREATMENT METHOD, AND RECORDINGMEDIUM STORING COMPUTER PROGRAMCARRYING OUT THE SAME

发明人:Hikaru Ito,Shinji Okada,Masami Yamashita申请号:US127881申请日:20100527

公开号:US201002377A1公开日:20100923

专利附图:

摘要:An experiment is conducted in advance, for finding a temperature of a cooling

plate attained as a result of balancing between a temperature of a substrate after heattreatment and a temperature of the cooling plate at the time of cooling of the substrate.Then, before heat treatment of a first substrate, the cooling plate is moved to a positionabove a hot plate, the cooling plate is heated to that temperature, and thereafter heattreatment of the substrate is started.

申请人:Hikaru Ito,Shinji Okada,Masami Yamashita

地址:Minato-ku JP,Koshi-shi JP,Minato-ku JP

国籍:JP,JP,JP

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