专利内容由知识产权出版社提供
专利名称：ADHESIVE BONDING OF PRINTED CIRCUIT
BOARDS TO HEAT SINKS
发明人：WARN, John, Kunno申请号：EP019591.0申请日：20010726公开号：EP1305987A1公开日：20030502
摘要：Voids (26) at the interface of a printed circuit board (10) bonded to a heat sink(24) which impede heat transfer from a heat generating electronic component (12)mounted on the printed circuit board (10) to the heat sink (24), and thus limit the densityof electronic components (12) that may be mounted to a given printed circuit board (10)are avoided by a method wherein the adhesive securing the printed circuit board (10) tothe heat sink (24) is formed of a pressure sensitive adhesive layer (22) and a
thermosetting adhesive layer (28). The latter fills the voids and thus provides for greaterthermal conductivity from a heat generating component (12) to the heat sink (24) withthe result in increase in heat rejection (30).
申请人：Hamilton Sundstrand Corporation
地址：One Hamilton Road Windsor Locks, CT 06096-1010 US
国籍：US
代理机构：Samuels, Adrian James
更多信息请下载全文后查看
