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专利名称：Method and apparatus for reflow-soldering
of electronic devices on a circuit board
发明人：VOLK, HELMUT申请号：EP91107731.1申请日：19910513公开号：EP0458163A2公开日：19911127
专利附图：
摘要：2.1 Improvement of the temperature control for printed-circuit boards ofdifferent thickness and devices of different size. …2.2 The transportation speeds of theconveyor belts (8, 14) which transport the printed-circuit board (10) through a preheating
oven (2) and a soldering oven (4) independently of one another are controlled such thatthe necessary temperatures are just reached in the case of the critical parts. …2.3 Reflowsoldering with preheating in a preheating zone, and soldering in a subsequent solderingzone. ……
申请人：SIEMENS NIXDORF INFORMATIONSSYSTEME AKTIENGESELLSCHAFT
地址：FUERSTENALLEE 7; W-4790 PADERBORN,Schlichtäcker 6 D-74223 Flein DE
国籍：DE
代理机构：Schaumburg, Thoenes & Thurn
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