专利内容由知识产权出版社提供
专利名称：HEAT-RADIATING SUBSTRATE AND
METHOD FOR MANUFACTURING THE SAME
发明人：Sung Keun PARK,Chang Hyun LIM,Seog
Moon CHOI,Kwang Soo KIM,Jung Eun KANG
申请号：US13007414申请日：20110114
公开号：US20120067623A1公开日：20120322
专利附图：
摘要：Disclosed herein is a heat-radiating substrate, including: a copper substrate; analumina layer formed on one side of the copper substrate; a first circuit layer formed onthe alumina layer; and a second circuit layer formed on the first circuit layer, wherein aheat-radiating element is mounted on a first pad of the first circuit layer or a second padof the second circuit layer, or is directly mounted on the exposed side of the coppersubstrate after forming an opening on the alumina layer.
申请人：Sung Keun PARK,Chang Hyun LIM,Seog Moon CHOI,Kwang Soo KIM,Jung EunKANG
地址：Gyunggi-do KR,Seoul KR,Seoul KR,Gyunggi-do KR,Gyunggi-do KR
国籍：KR,KR,KR,KR,KR
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