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专利名称：Method and apparatus for thermally
insulating a wafer support
发明人：Bryan D. Schmidt申请号：US07/9947申请日：19921224公开号：US05343938A公开日：19940906
摘要：Apparatus and method for reducing heat transfer from a motor to a wafer in aspin-on coating apparatus. The interior of the wafer chuck or spindle is provided with agap, chamber or void that is either evacuated or is filled with a selected gas or otherthermal barrier having low thermal conductivity compared to the wafer chuck material orthe spindle material. Optionally, the wafer chuck or the spindle may be provided with aplurality of apertures that allow the gas in the gap to flow to a region outside the waferchuck or the spindle.
申请人：VLSI TECHNOLOGY, INC.
代理机构：Hickman & Beyer
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