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专利名称：Room temperature curable polybutadiene
resins with copper ethylacetoacetatecatalyst
发明人：James R. Kwiecinski申请号：US06/591358申请日：19840320公开号：US04554322A公开日：19851119
摘要：Disclosed is a polybutadiene containing resin system which is curable at roomtemperature by the addition of copper ethylacetoacetate. The resin system consists ofabout 5 to about 25% polybutadiene, about 55 to about 90% dicyclopentadiene acrylate,about 5 to about 20% of a monomer having 2 to 4 unsaturated groups selected fromvinylic, acrylic, and mixtures thereof, about 0.25 to about 3% free radical initiator, andabout 0.1 to about 0.8% of a coaccelerator. Also disclosed is a method of curing a resinsystem and various products made therewith.
申请人：WESTINGHOUSE ELECTRIC CORP.
代理人：R. D. Fuerle
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