专利内容由知识产权出版社提供
专利名称：Semiconductor chip package and fabrication
method thereof
发明人：Joong Ha You申请号：US09416272申请日：19991012公开号：US06277670B1公开日：20010821
专利附图：
摘要：A chip package according to an embodiment of the present invention includesan integrated chip having a plurality of chip pads formed thereon, and a passivation filmformed in such a manner that the chip pads are exposed. A plurality of metal wirings are
connected to the chip pads on the upper surface of the passivation film, and externalsballs electrically connected to the metal wirings. A molding resin layer is formed on theupper portion of the semiconductor chip such that the upper surfaces of the externalballs protrude therefrom.
申请人：HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
代理机构：Fleshner & Kim, LLP
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