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专利名称：Vacuum processing apparatus, vacuum
processing method, and method forcleaning the vacuum processing apparatus
发明人：Hideki Lee申请号：US08/255950申请日：19940607公开号：US05616208A公开日：19970401
摘要：A vacuum processing apparatus includes a plurality of vacuum processingchambers for processing a target object using a process gas, a vacuum convey chamber,connected to the plurality of vacuum processing chambers, for loading/unloading thetarget object into/from the processing chambers, an opening/closing means
opened/closed to cause the plurality of vacuum processing chambers to communicatewith the vacuum convey chamber, and a cleaning gas supply means for supplying acleaning gas containing ClF.sub.3 into at least one of the vacuum convey chamber and theplurality of vacuum processing chambers. The cleaning gas is supplied-into the pluralityof vacuum processing chambers and the vacuum convey chamber communicating witheach other by opening the opening/closing means to clean the plurality of vacuumprocessing chambers and the vacuum convey chamber.
申请人：TOKYO ELECTRON LIMITED
代理机构：Oblon, Spivak, McClelland, Maier & Neustadt, P
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