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专利名称：Dynamic metrology sampling with wafer
uniformity control
发明人：Merritt Funk,Radha Sundararajan,Daniel
Joseph Prager,Wesley Natzle
申请号：US11390415申请日：20060328
公开号：US20070238201A1公开日：20071011
专利附图：
摘要：A method of processing a wafer is presented that includes creating a pre-processing measurement map using measured metrology data for the wafer including
metrology data for at least one isolated structure on the wafer, metrology data for atleast one nested structure on the wafer, bi-layer mask data, and BARC layer data. At leastone pre-processing prediction map is calculated for the wafer. A pre-processing
confidence map is calculated for the wafer. The pre-processing confidence map includes aset of confidence data for the plurality of dies on the wafer. A prioritized measurementsite is determined when the confidence data for one or more dies is not within theconfidence limits. A new measurement recipe that includes the prioritized measurementsite is then created.
申请人：Merritt Funk,Radha Sundararajan,Daniel Joseph Prager,Wesley Natzle
地址：Austin TX US,Dripping Springs TX US,Hopewell Junction NY US,New Paltz NY US
国籍：US,US,US,US
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