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专利名称：Coating film forming method and apparatus发明人：Shiraishi, Masatoshi, Legal & Intell. Prop.
Dept.,Kiba, Yukio, Legal & Intell. Prop.Dept.,Ogata, Kunie, Legal & Intell. Prop.Dept.
申请号：EP97108418.1申请日：19970524公开号：EP0810633B1公开日：20031022
摘要：A coating film forming method for forming a resist coating film on an uppersurface of a wafer held by a spin chuck in a chamber includes (a) the step of keepingpreliminary correlation data representing correlation between a wafer rotating speedand the thickness of the resist coating film formed on the wafer in the chamber, (b) thestep of conveying the wafer into the chamber and holding the wafer by the spin chuck, (c)the step of pouring the resist liquid onto the wafer and spin-rotating the wafer to form aresist coating film on the upper surface of the wafer, (d) the step of detecting thethickness of the formed resist coating film by a sensor, (e) the step of detecting arotating speed of the spin chuck by a sensor, and (f) the step of, on the basis of thedetected film thickness and the preliminary correlation data, correcting a set rotatingspeed of the spin chuck to feedback-control a resist coating process for a next wafer.
申请人：TOKYO ELECTRON LTD
地址：JP
国籍：JP
代理机构：Gramm, Werner, Prof. Dipl.-Ing.
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