STQ2HNK60ZR-AP
STF2HNK60Z-STD2HNK60Z-1
N-CHANNEL600V-4.4Ω -2.0ATO-92/TO-220FP/IPAK
Zener-ProtectedSuperMESH™MOSFET
TYPE
STQ2HNK60ZR-APSTD2HNK60Z-1STF2HNK60Z
VDSS600V600V600V
RDS(on)<4.8Ω<4.8Ω<4.8Ω
ID0.5A2.0A2.0A
PW3W45W20W
123TYPICALRDS(on)=4.4Ω
EXTREMELYHIGHdv/dtCAPABILITYESDIMPROVEDCAPABILITY100%AVALANCHETESTED
NEWHIGHVOLTAGEBENCHMARKGATECHARGEMINIMIZED
TO-92(Ammopack)TO-220FP123IPAKDESCRIPTION
TheSuperMESH™seriesisobtainedthroughanextremeoptimizationofST’swellestablishedstrip-basedPowerMESH™layout.Inadditiontopushingon-resistancesignificantlydown,specialcareistak-entoensureaverygooddv/dtcapabilityforthemostdemandingapplications.Suchseriescomple-mentsSTfullrangeofhighvoltageMOSFETsin-cludingrevolutionaryMDmesh™products.
INTERNALSCHEMATICDIAGRAMAPPLICATIONS
ACADAPTORSANDBATTERYCHARGERSSWITHMODEPOWERSUPPLIES(SMPS)
ORDERCODES
PARTNUMBERSTD2HNK60Z-1STQ2HNK60ZR-APSTF2HNK60Z
MARKINGD2HNK60ZQ2HNK60ZRF2HNK60Z
PACKAGEIPAKTO-92TO-220FP
PACKAGING
TUBEAMMOPAKTUBE
April20041/12
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STQ2HNK60ZR-AP-STF2HNK60Z-STD2HNK60Z-1
ABSOLUTEMAXIMUMRATINGS
SymbolVDSVDGRVGSIDIDIDM()PTOTVESD(G-S)dv/dt(1)VISOTjTstg
Parameter
IPAK
Drain-sourceVoltage(VGS=0)Drain-gateVoltage(RGS=20kΩ)Gate-sourceVoltage
DrainCurrent(continuous)atTC=25°CDrainCurrent(continuous)atTC=100°CDrainCurrent(pulsed)TotalDissipationatTC=25°CDeratingFactor
GatesourceESD(HBM-C=100pF,R=1.5KΩ)PeakDiodeRecoveryvoltageslopeInsulationWithstandVoltage(DC)OperatingJunctionTemperatureStorageTemperature
--2.01.268450.36
ValueTO-220FP600600±302.0(*)1.26(*)8(*)200.1620004.52500-55to150
--0.50.32230.025TO-92
VVVAAAWW/°CVV/nsV°CUnit
()Pulsewidthlimitedbysafeoperatingarea
(1)ISD≤2A,di/dt≤200A/µs,VDD≤V(BR)DSS,Tj≤TJMAX.(*)CurrentLimitedbypackage
THERMALDATA
IPAK
Rthj-caseRthj-ambRthj-lead
Tl
ThermalResistanceJunction-caseMaxThermalResistanceJunction-ambientMaxThermalResistanceJunction-leadMaxMaximumLeadTemperatureForSolderingPurpose
2.77100--300
TO-220FP6.2562.5--300
TO-92--12040260
°C/W°C/W°C/W°C
AVALANCHECHARACTERISTICS
SymbolIAREAS
Parameter
AvalancheCurrent,RepetitiveorNot-Repetitive(pulsewidthlimitedbyTjmax)
SinglePulseAvalancheEnergy
(startingTj=25°C,ID=IAR,VDD=50V)
MaxValue
2120
UnitAmJ
GATE-SOURCEZENERDIODE
SymbolBVGSO
Parameter
Gate-SourceBreakdownVoltage
TestConditionsIgs=±1mA(OpenDrain)
Min.30
Typ.
Max.
UnitV
PROTECTIONFEATURESOFGATE-TO-SOURCEZENERDIODES
Thebuilt-inback-to-backZenerdiodeshavespecificallybeendesignedtoenhancenotonlythedevice’sESDcapability,butalsotomakethemsafelyabsorbpossiblevoltagetransientsthatmayoccasionallybeappliedfromgatetosource.InthisrespecttheZenervoltageisappropriatetoachieveanefficientandcost-effectiveinterventiontoprotectthedevice’sintegrity.TheseintegratedZenerdiodesthusavoidtheusageofexternalcomponents.
2/12
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STQ2HNK60ZR-AP-STF2HNK60Z-STD2HNK60Z-1
ELECTRICALCHARACTERISTICS(TCASE=25°CUNLESSOTHERWISESPECIFIED)ON/OFF
SymbolV(BR)DSSIDSSIGSSVGS(th)RDS(on)
Parameter
Drain-source
BreakdownVoltageZeroGateVoltage
DrainCurrent(VGS=0)Gate-bodyLeakageCurrent(VDS=0)GateThresholdVoltageStaticDrain-sourceOnResistance
TestConditions
ID=1mA,VGS=0
VDS=MaxRating
VDS=MaxRating,TC=125°CVGS=±20V
VDS=VGS,ID=50µAVGS=10V,ID=1.0A
3
3.754.4
Min.600
150±104.54.8
Typ.
Max.
UnitVµAµAµAVΩ
DYNAMIC
Symbolgfs(1)CissCossCrssCosseq.(3)td(on)trtd(off)tfQgQgsQgd
Parameter
ForwardTransconductanceInputCapacitanceOutputCapacitanceReverseTransferCapacitanceEquivalentOutputCapacitanceTurn-onDelayTimeRiseTime
Turn-offDelayTimeFallTime
TotalGateChargeGate-SourceChargeGate-DrainCharge
TestConditions
VDS=15V,ID=1.0A
VDS=25V,f=1MHz,VGS=0
Min.
Typ.1.52803873010302350112.256
15Max.
UnitSpFpFpFpFnsnsnsnsnCnCnC
VGS=0V,VDS=0Vto480VVDD=300V,ID=1.0ARG=4.7ΩVGS=10V
(ResistiveLoadsee,Figure3)VDD=480V,ID=2.0A,VGS=10V
SOURCEDRAINDIODE
SymbolISDISDM(2)VSD(1)trrQrrIRRMtrrQrrIRRM
Parameter
Source-drainCurrent
Source-drainCurrent(pulsed)ForwardOnVoltageReverseRecoveryTimeReverseRecoveryChargeReverseRecoveryCurrentReverseRecoveryTimeReverseRecoveryChargeReverseRecoveryCurrent
ISD=2.0A,VGS=0ISD=2.0A,di/dt=100A/µsVDD=20V,Tj=25°C(seetestcircuit,Figure5)ISD=13A,di/dt=100A/µsVDD=20V,Tj=150°C(seetestcircuit,Figure5)
17844552005005
TestConditions
Min.
Typ.
Max.2.08.01.6
UnitAAVnsnCAnsnCA
Note:1.Pulsed:Pulseduration=300µs,dutycycle1.5%.
2.Pulsewidthlimitedbysafeoperatingarea.
3.Cosseq.isdefinedasaconstantequivalentcapacitancegivingthesamechargingtimeasCosswhenVDSincreasesfrom0to80%VDSS.
3/12
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STQ2HNK60ZR-AP-STF2HNK60Z-STD2HNK60Z-1
SafeOperatingAreaforTO-92
ThermalImpedanceforTO-92
SafeOperatingAreaforTO-220FPThermalImpedanceforTO-220FPSafeOperatingAreaforIPAKThermalImpedanceforIPAK4/12元器件交易网www.cecb2b.com
STQ2HNK60ZR-AP-STF2HNK60Z-STD2HNK60Z-1
OutputCharacteristicsTransferCharacteristicsTransconductanceStaticDrain-sourceOnResistanceGateChargevsGate-sourceVoltageCapacitanceVariations5/12
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STQ2HNK60ZR-AP-STF2HNK60Z-STD2HNK60Z-1
NormalizedGateTheresholdVoltagevsTemp.NormalizedOnResistancevsTemperatureSource-drainDiodeForwardCharacteristics
NormalizedBVDSSvsTemperature
MaximumAvalancheEnergyvsTemperature6/12
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STQ2HNK60ZR-AP-STF2HNK60Z-STD2HNK60Z-1
Fig.1:UnclampedInductiveLoadTestCircuit
Fig.2:UnclampedInductiveWaveform
Fig.3:SwitchingTimesTestCircuitForResistiveLoad
Fig.4:GateChargetestCircuit
Fig.5:TestCircuitForInductiveLoadSwitchingAndDiodeRecoveryTimes
7/12
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STQ2HNK60ZR-AP-STF2HNK60Z-STD2HNK60Z-1
TO-92 MECHANICAL DATAmm.MIN.4.320.3.453.302.411.1412.702.160.920.415°TYPMAX.4.950.514.953.942.671.4015.492.411.520.56MIN.0.1700.0140.1750.1300.0940.0440.500.0850.0360.0165°inchTYP.MAX.0.1940.0200.1940.1550.1050.0550.6100.0940.0600.022DIM.AbDEee1LRS1WV8/12
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STQ2HNK60ZR-AP-STF2HNK60Z-STD2HNK60Z-1
TO-92AMMOPACK
mm.
MIN.4.453.30
TYP
MAX.4.953.941.62.3
0.4112.55.652.44-217.55.78.518.515.53.8
1186912.76.352.54
0.5612.97.052.942196.39.250.520.516.5254.20.911
3-1
1
0.11-0.04
0.04
0.15
0.157
0.720.61
0.63
0.0160.490.220.09-0.080.690.220.33
0.710.230.350.50.250.1
MIN.0.1700.130
inchTYP.
MAX.0.1940.1550.060.090.0220.510.270.110.080.740.240.360.020.800.650.980.160.0350.43
DIM.A1TT1T2dP0P2F1,F2deltaHWW0W1W2HH0H1D0tLl1deltaP
9/12
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STQ2HNK60ZR-AP-STF2HNK60Z-STD2HNK60Z-1
TO-220FP MECHANICAL DATAmm.MIN.4.42.52.50.450.751.151.154.952.4101628.69.82.915.99330.610.63.616.49.33.21.126.03850.1140.6260.3540.118TYPMAX.4.62.72.750.711.71.75.22.710.4MIN.0.1730.0980.0980.0170.0300.0450.0450.1950.0940.3930.6301.2040.4170.1410.50.3660.126inchTYP.MAX.0.1810.1060.1080.0270.0390.0670.0670.2040.1060.409DIM.ABDEFF1F2GG1HL2L3L4L5L6L7ØABL3L6L7F1DFG1EHF2L2L5123L410/12
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STQ2HNK60ZR-AP-STF2HNK60Z-STD2HNK60Z-1
TO-251 (IPAK) MECHANICAL DATADIM.AA1A3BB2B3B5B6CC2DEGHLL1L20.450.4866.44.415.990.80.80.30.950.60.66.26..616.39.41.210.0170.0190.2360.2520.1730.6260.3540.0310.031mmMIN.2.20.90.70.5.2TYP.MAX.2.41.10.95.40.850.0120.0370.0230.0230.2440.2600.1810.10.3700.0470.039MIN.0.0860.0350.0250.204inchTYP.MAX.0.0940.0430.0510.0310.2120.0331.3 0.027HA C C2 1 2 3 L2DB3 B6 A1 L= = = = B5 B A3 L1= = B2 G E 0068771-E11/12
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STQ2HNK60ZR-AP-STF2HNK60Z-STD2HNK60Z-1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for theconsequences of use of such information nor for any infringement of patents or other rights of third parties which may result fromits use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specificationsmentioned in this publication are subject to change without notice. This publication supersedes and replaces all informationpreviously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices orsystems without express written approval of STMicroelectronics.The ST logo is a registered trademark of STMicroelectronicsAll other names are the property of their respective owners© 2004 STMicroelectronics - All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.http://www.st.com12/12
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