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专利名称：RFID interposer with impedance matching发明人：Ian J. Forster,Barry J. Roberts申请号：US11861371申请日：20070926公开号：US07880614B2公开日：20110201
专利附图：
摘要：An RFID interposer has conductive material that includes an impedancematching structure. The impedance matching structure aids in matching impedancebetween a chip that is to be mounted to the interposer, and an antenna that theinterposer is to be coupled to. The impedance matching structures may allow different
chips, with slightly different electrical characteristics, to be impedance matched to thesame antenna configuration, using the same type of interposer. The impedance matchingstructure may have any of a variety of configurations in the electrically conductivematerial of the interposer. The structure may be parts of the chip mounting bond pads,may be part of the conductive electrical connection between the chip bond pads andantenna bond pads, may be part of connections between the chip bond pads and theantenna bond pads, and/or may be only indirectly electrically coupled to the antennabond pads (such as by capacitive coupling).
申请人：Ian J. Forster,Barry J. Roberts
地址：Essex GB,Essex GB
国籍：GB,GB
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