专利内容由知识产权出版社提供
专利名称：METHOD FOR MAKING ADVANCED SMART
CARDS WITH INTEGRATED ELECTRONICSUSING ISOTROPIC THERMOSET ADHESIVEMATERIALS WITH HIGH QUALITY EXTERIORSURFACES
发明人：REED, PAUL申请号：EP05729405申请日：20050323公开号：EP18249A4公开日：20081029
摘要：Advanced Smart Cards and similar form factors (e.g. documents, tags) havinghigh quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), syntheticpaper or other suitable material can be made with highly sophisticated electroniccomponents (e.g. Integrated Circuit chips, batteries, microprocessors, Light EmittingDiodes, Liquid Crystal Displays, polymer dome switches, and antennae), integrated in thebottom layer of the card structure, through use of injection molded thermosetting orthermoplastic material that becomes the core layer of said Advanced Smart Cards. Alamination finishing process can provide a high quality lower surface, and theencapsulation of the electronic components in the thermosetting or thermoplasticmaterial provides protection from the lamination heat and pressure.
申请人：CARDXX, INC
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