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专利名称：Method for Making Advanced Smart Cards
With Integrated Electronics Using IsotropicThermoset Adhesive Materials With HighQuality Exterior Surfaces
发明人：Paul Reed申请号：US11661206申请日：20050323
公开号：US20080096326A1公开日：20080424
专利附图：
摘要：Advanced Smart Cards and similar form factors (e.g. documents, tags) having
high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), syntheticpaper or other suitable material can be made with highly sophisticated electroniccomponents (e.g. Integrated Circuit chips, batteries, microprocessors, Light EmittingDiodes, Liquid Crystal Displays, polymer dome switches, and antennae), integrated in thebottom layer of the card structure, through use of injection molded thermosetting orthermoplastic material that becomes the core layer of said Advanced Smart Cards. Alamination finishing process can provide a high quality lower surface, and theencapsulation of the electronic components in the thermosetting or thermoplasticmaterial provides protection from the lamination heat and pressure.
申请人：Paul Reed
地址：Shoreline WA US
国籍：US
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