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专利名称：Multi-chip module and method of
manufacture
发明人：John Yan,Yong Du,Bruce E. Symons申请号：US11116571申请日：20050427公开号：US07163839B2公开日：20070116
专利附图：
摘要：A multi-chip module and a method for manufacturing the multi-chip module. Afirst semiconductor chip is mounted to a support substrate and a second semiconductorchip is mounted to the first semiconductor chip. The second semiconductor chip has a
smaller dimension than the first semiconductor chip. A spacer is coupled to the secondsemiconductor chip. Bonding pads on the first and second semiconductor chips arewirebonded to bonding pads on the support substrate. A third semiconductor chip ismounted to the spacer and bonding pads on the third semiconductor chip arewirebonded to bonding pads on the support substrate.
申请人：John Yan,Yong Du,Bruce E. Symons
地址：Fremont CA US,Cupertino CA US,Pleasanton CA US
国籍：US,US,US
代理人：Raj Jaipershad,Rennie Wm. Dover
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