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专利名称：Conductive paste发明人：堀元 章弘,宮地 麻代申请号：JP2020074965申请日：20200420公开号：JP2020115475A公开日：20200730
专利附图：
摘要：Problem to be solved: to provide a conductive paste capable of obtaining aconductive resin film excellent in printing and durability. The conductive paste of thepresent invention includes an elastomer composition containing silica particles (c), aconductive filler, and a solvent. Diagram
申请人：住友ベークライト株式会社
地址：東京都品川区東品川２丁目５番８号
国籍：JP
代理人：速水 進治
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