专利内容由知识产权出版社提供
专利名称：Mechanical assembly for regulating the
temperature of an electronic device whichincorporates a single leaf spring for self-alignment plus a low initial contact force anda low profile
发明人：Jerry Ihor Tustaniwskyj,James Wittman
Babcock,Richard Leigh Bumann
申请号：US09/210266申请日：19981210公开号：US06116331A公开日：20000912
摘要：A mechanical assembly for regulating the temperature of an integrated circuitchip is comprised of a frame which has two spaced- apart spring supports. A single leafspring extends from one of the spring supports to the other. A heat exchanger contactsthe leaf spring at one point, pushes the leaf spring against the spring supports, and has aface for mating with the chip. And, a stop is provided between the heat exchanger and theframe, which keeps the heat exchanger on the leaf spring. With this assembly the heatexchanger exerts a very small force at its initial point of contact on the chip; the length ofthe single leaf spring does not add to the profile of the assembly; no slippage occursbetween the heat exchanger and the chip; and, the stop prevents the heat exchangerfrom twisting and becoming offset relative to the chip.
申请人：UNISYS CORPORATION
代理人：Charles J. Fassbender,Mark T. Starr,Steven B. Samuels
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