专利内容由知识产权出版社提供
专利名称：Apparatus for measuring a mechanical
quantity
发明人：Takashi Sumigawa,Hiroyuki Ohta申请号：US11303730申请日：20051216公开号：US07430920B2公开日：20081007
专利附图：
摘要：An apparatus structure and measurement method are provided to retain highprecision and high reliability of a semiconductor mechanical quantity measuringapparatus which senses a mechanical quantity and transmits measured information
wirelessly. As to a silicon substrate of the semiconductor mechanical quantity measuringapparatus, for example, a ratio of a substrate thickness to a substrate length along ameasurement direction is set small, and a ratio of a substrate thickness to a substratelength along a direction perpendicular to the measurement direction is set small. Theapparatus upper surface is covered with a protective member. It is possible to measure astrain along a particular direction and realize mechanical quantity measurement with lesserror and high precision. An impact resistance and environment resistance of theapparatus itself can be improved.
申请人：Takashi Sumigawa,Hiroyuki Ohta
地址：Fukuoka JP,Tsuchiura JP
国籍：JP,JP
代理机构：Townsend and Townsend and Crew LLP
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