PCA9550TK资料

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PCA9550

2-bit I2C-bus LED driver with programmable blink rates

Rev. 05 — 13 October 2008

Product data sheet

1.General description

The PCA9550 LED blinker blinks LEDs in I2C-bus and SMBus applications where it isnecessary to limit bus trafﬁc or free up the I2C master's (MCU, MPU, DSP, chipset, etc.)timer.Theuniquenessofthisdeviceistheinternaloscillatorwithtwoprogrammableblinkrates. To blink LEDs using normal I/O expanders like the PCF8574 or PCA9554, the busmastermustsendrepeatedcommandstoturntheLEDonandoff.ThisgreatlyincreasestheamountoftrafﬁcontheI2C-busandusesuponeofthemaster'stimers.ThePCA9550LED blinker instead requires only the initial set-up command to program BLINKRATE1andBLINKRATE2(i.e.,thefrequencyanddutycycle).Fromthenon,onlyonecommandfrom the bus master is required to turn each individual open-drain output ON, OFF, or tocycle at BLINKRATE1 or BLINKRATE2. Maximum output sink current is 25mA per bitand 50mA per package.

Any bits not used for controlling the LEDs can be used for General Purpose parallelInput/Output (GPIO) expansion.

The activeLOW hardware reset pin (RESET) and Power-On Reset (POR) initializes theregisters to their default state, all zeroes, causing the bits to be set HIGH (LED off).One hardware address pin on the PCA9550 allows two devices to operate on the samebus.

2.Features

I2 LED drivers (on, off, ﬂashing at a programmable rate)

I2 selectable, fully programmable blink rates (frequency and duty cycle) between0.172Hz and 44Hz (5.82seconds and 0.023second)

IInput/output not used as LED drivers can be used as regular GPIOsIInternal oscillator requires no external componentsII2C-bus interface logic compatible with SMBusIInternal power-on reset

INoise ﬁlter on SCL/SDA inputsIActiveLOW reset input

I2 open-drain outputs directly drive LEDs to 25mAIControlled edge rates to minimize ground bounceINo glitch on power-upISupports hot insertionILow standby current

IOperating power supply voltage range of 2.3V to 5.5VI0kHz to 400kHz clock frequency

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NXP Semiconductors

PCA9550

2-bit I2C-bus LED driver with programmable blink rates

IESD protection exceeds 2000V HBM per JESD22-A114, 150V MM perJESD22-A115 and 1000V CDM per JESD22-C101

ILatch-up testing is done to JEDEC Standard JESD78 which exceeds 100mAIPackages offered: SO8, TSSOP8 (MSOP8), HVSON8

3.Ordering information

Table 1.

Ordering information

PackageNamePCA9550DPCA9550DPPCA9550TK

SO8TSSOP8[1]HVSON8

Descriptionplastic small outline package; 8leads; body width 3.9mm

plastic thin shrink small outline package; 8leads; body width 3mm

VersionSOT96-1SOT505-1

Type numberplasticthermalenhancedverythinsmalloutlinepackage;noleads;8terminals;SOT908-1body 3×3×0.85mm

[1]Also known as MSOP8.

3.1Ordering options

Table 2.PCA9550DPCA9550DPPCA9550TK

Ordering options

Topside markPCA955095509550

Temperature rangeTamb =−40°C to +85°CTamb =−40°C to +85°CTamb =−40°C to +85°C

Type number4.Block diagram

A0PCA9550INPUTREGISTERI2C-BUSCONTROLLED SELECT (LS0)REGISTERSCLSDAINPUTFILTERS0VDDRESET1PRESCALER 0REGISTEROSCILLATORVSSPRESCALER 1REGISTERPWM0REGISTERPWM1REGISTERBLINK0BLINK1POWER-ONRESETLEDn002aad241Only one I/O shown for clarity.Fig 1.Block diagram of PCA9550PCA9550_5© NXP B.V. 2008. All rights reserved.

Product data sheetRev. 05 — 13 October 20082 of 26

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PCA9550

2-bit I2C-bus LED driver with programmable blink rates

5.Pinning information

5.1Pinning

A0LED0LED1VSS1234002aad2388VDDSDASCLRESETA0LED0LED1VSS1234002aad2398VDDSDASCLRESETPCA9550D765PCA9550DP765Fig 2.Pin conﬁguration for SO8terminal 1index areaFig 3.Pin conﬁguration for TSSOP8A0LED0LED1VSS1287VDDSDASCLRESETPCA9550TK3465002aad240Transparent top viewFig 4.Pin conﬁguration for HVSON85.2Pin description

Table 3.SymbolA0LED0LED1VSSRESETSCLSDAVDD

Pin description

Pin12345678

Descriptionaddress input 0LED driver 0LED driver 1supply groundactiveLOW reset inputserial clock lineserial data linesupply voltage

Product data sheetRev. 05 — 13 October 20083 of 26

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PCA9550

2-bit I2C-bus LED driver with programmable blink rates

6.Functional description

Refer toFigure 1 “Block diagram of PCA9550”.

6.1Device address

Following a START condition, the bus master must output the address of the slave it isaccessing. The address of the PCA9550 is shown inFigure5. To conserve power, nointernalpull-upresistorisincorporatedonthehardwareselectableaddresspinanditmustbe pulled HIGH or LOW.

slave address110000A0R/Wfixedhardwareselectable002aad242Fig 5.PCA9550 slave addressThelastbitoftheaddressbytedeﬁnestheoperationtobeperformed.Whensettologic1a read is selected, while a logic0 selects a write operation.

6.2Control register

Followingthesuccessfulacknowledgementoftheslaveaddress,thebusmasterwillsenda byte to the PCA9550, which will be stored in the Control register.

000AI0B2B1B0Auto-Increment flagregister address002aad243Reset state: 00hFig 6.Control registerThe lowest 3bits are used as a pointer to determine which register will be accessed.If the Auto-Increment (AI) ﬂag is set, the three low order bits of the Control register areautomatically incremented after a read or write. This allows the user to program the

registerssequentially.Thecontentsofthesebitswillrolloverto‘000’afterthelastregisteris accessed.

When the Auto-Increment ﬂag is set (AI=1) and a read sequence is initiated, thesequence must start by reading a register different from the input register(B2B1B0≠000).

Only the 3 least signiﬁcant bits are affected by the AI ﬂag. Unused bits must beprogrammed with zeroes.

Product data sheetRev. 05 — 13 October 20084 of 26

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PCA9550

2-bit I2C-bus LED driver with programmable blink rates

6.2.1Control register deﬁnition

Table 4.B2000011

B1001100

B0010101

Accessread onlyread/writeread/writeread/writeread/writeread/write

Descriptioninput registerfrequency prescaler 0PWM register 0frequency prescaler 1PWM register 1LED selector

6.3Register descriptions

6.3.1INPUT - Input register

The INPUT register reﬂects the state of the device pins. Writes to this register will beacknowledged but will have no effect.

Table 5.BitSymbolDefault000INPUT - Input register description

765not used0004321LED1X0LED0XRemark:Thedefaultvalue‘X’isdeterminedbytheexternallyappliedlogiclevel(normallylogic1) when used for directly driving LED with pull-up to VDD.

6.3.2PSC0 - Frequency Prescaler0

PSC0 is used to program the period of the PWM output.The period of BLINK0=(PSC0+1)/44.

Table 6.BitSymbolDefaultPSC0 - Frequency Prescaler0 register description

7PSC0[7]16PSC0[6]15PSC0[5]14PSC0[4]13PSC0[3]12PSC0[2]11PSC0[1]10PSC0[0]16.3.3PWM0 - Pulse Width Modulation0

ThePWM0registerdeterminesthedutycycleofBLINK0.TheoutputsareLOW(LEDoff)when the count is less than the value in PWM0 and HIGH when it is greater. If PWM0 isprogrammed with 00h, then the PWM0 output is always LOW.The duty cycle of BLINK0=(256−PWM0)/256.

Table 7.BitSymbolDefaultPWM0 - Pulse Width Modulation 0 register description

Product data sheetRev. 05 — 13 October 20085 of 26

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PCA9550

2-bit I2C-bus LED driver with programmable blink rates

6.3.4PSC1 - Frequency Prescaler1

PSC1 is used to program the period of the PWM output.The period of BLINK1=(PSC1+1)/44.

Table 8.BitSymbolDefaultPSC1 - Frequency Prescaler1 register description

7PSC1[7]16PSC1[6]15PSC1[5]14PSC1[4]13PSC1[3]12PSC1[2]11PSC1[1]10PSC1[0]16.3.5PWM1 - Pulse Width Modulation1

ThePWM1registerdeterminesthedutycycleofBLINK1.TheoutputsareLOW(LEDoff)when the count is less than the value in PWM1 and HIGH when it is greater. If PWM1 isprogrammed with 00h, then the PWM1 output is always LOW.The duty cycle of BLINK1=(256−PWM1)/256.

Table 9.BitSymbolDefaultPWM1 - Pulse Width Modulation 1 register description

7PWM1[7]16PWM1[6]05PWM1[5]04PWM1[4]03PWM1[3]02PWM1[2]01PWM1[1]00PWM1[0]06.3.6LS0 - LED selector

The LS0 LED select register determines the source of the LED data.00=output is set LOW (LED on)

01=output is set high-impedance (LED off; default)10=output blinks at PWM0 rate11=output blinks at PWM1 rate

Table 10.BitSymbolDefault11LS0 - LED selector register description

Product data sheetRev. 05 — 13 October 20086 of 26

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PCA9550

2-bit I2C-bus LED driver with programmable blink rates

6.4Pins used as GPIOs

LED pins not used to control LEDs can be used as General Purpose Input/Outputs(GPIOs).

For use as input, set LEDn to high-impedance (01) and then read the pin state via theInput register.

For use as output, connect external pull-up resistor to the pin and size it according to theDC recommended operating characteristics. LEDn output pin is HIGH when the output isprogrammedashigh-impedance,andLOWwhentheoutputisprogrammedLOWthroughtheLEDselectorregister(LS0).Theoutputcanbepulse-widthcontrolledwhenPWM0orPWM1 are used.

6.5Power-on reset

When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9550 inaresetconditionuntilVDDhasreachedVPOR.Atthatpoint,theresetconditionisreleasedand the PCA9550 registers are initialized to their default states, all the outputs in theOFFstate. Thereafter, VDD must be lowered below 0.2V to reset the device.

6.6ExternalRESETAresetcanbeaccomplishedbyholdingtheRESETpinLOWforaminimumoftw(rst).ThePCA9550 registers and I2C-bus state machine will be held in their default states until theRESET input is once again HIGH.This input requires a pull-up resistor to VDD if no active connection is used.

Product data sheetRev. 05 — 13 October 20087 of 26

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PCA9550

2-bit I2C-bus LED driver with programmable blink rates

7.Characteristics of the I2C-bus

TheI2C-busisfor2-way,2-linecommunicationbetweendifferentICsormodules.Thetwolines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be

connected to a positive supply via a pull-up resistor when connected to the output stagesof a device. Data transfer may be initiated only when the bus is not busy.

7.1Bit transfer

Onedatabitistransferredduringeachclockpulse.ThedataontheSDAlinemustremainstable during the HIGH period of the clock pulse as changes in the data line at this timewill be interpreted as control signals (seeFigure7).

SDASCLdata linestable;data validchangeof dataallowedmba607Fig 7.Bit transfer7.1.1START and STOP conditions

Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW

transition of the data line while the clock is HIGH is deﬁned as the START condition (S).ALOW-to-HIGHtransitionofthedatalinewhiletheclockisHIGHisdeﬁnedastheSTOPcondition (P) (seeFigure8).

SDASDASCLSSTART conditionPSTOP conditionSCLmba608Fig 8.Deﬁnition of START and STOP conditions7.2System conﬁguration

A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. Thedevice that controls the message is the ‘master’ and the devices which are controlled bythe master are the ‘slaves’ (seeFigure9).

Product data sheetRev. 05 — 13 October 20088 of 26

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PCA9550

2-bit I2C-bus LED driver with programmable blink rates

SDASCLMASTERTRANSMITTER/RECEIVERSLAVERECEIVERSLAVETRANSMITTER/RECEIVERMASTERTRANSMITTERMASTERTRANSMITTER/RECEIVERI2C-BUSMULTIPLEXERSLAVE002aaa966Fig 9.System conﬁguration7.3Acknowledge

The number of data bytes transferred between the START and the STOP conditions fromtransmitter to receiver is not limited. Each byte of eightbits is followed by one

acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,whereas the master generates an extra acknowledge related clock pulse.

Aslavereceiverwhichisaddressedmustgenerateanacknowledgeafterthereceptionofeach byte. Also a master must generate an acknowledge after the reception of each bytethat has been clocked out of the slave transmitter. The device that acknowledges has topulldowntheSDAlineduringtheacknowledgeclockpulse,sothattheSDAlineisstableLOW during the HIGH period of the acknowledge related clock pulse; set-up and holdtimes must be taken into account.

A master receiver must signal an end of data to the transmitter by not generating anacknowledge on the last byte that has been clocked out of the slave. In this event, thetransmitter must leave the data line HIGH to enable the master to generate a STOPcondition.

data outputby transmitternot acknowledgedata outputby receiveracknowledgeSCL from masterSSTARTcondition128clock pulse foracknowledgement9002aaa987Fig 10.Acknowledgement on the I2C-busPCA9550_5© NXP B.V. 2008. All rights reserved.

Product data sheetRev. 05 — 13 October 200 of 26

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PCA9550

2-bit I2C-bus LED driver with programmable blink rates

7.4Bus transactions

SCL1234567command byte0A00R/WA000AI0B2B1B0Aacknowledgefrom slavedata to registerDATA 1Aacknowledgefrom slaveslave addressSDAS11000START conditionwrite to registeracknowledgefrom slavetv(Q)data out from portDATA 1 VALID002aad268Fig 11.Write to registerslave addressSDAS110000A00R/WA00command byte0AI0B2B1B0Aacknowledgefrom slavedata from registerADATA (first byte)Auto-Incrementregister addressif AI = 1Aacknowledgefrom masterdata from registerDATA (last byte)NAPSTOPcondition(cont.)START conditionacknowledgefrom slaveslave address(cont.)S110000A01R/Wacknowledgefrom slave(repeated)START conditionno acknowledgefrom masterat this moment master-transmitter becomes master-receiverand slave-receiver becomes slave-transmitter002aad269Fig 12.Read from registerno acknowledgefrom masterslave addressSDAS110000A01R/WAacknowledgefrom slavedata from portDATA 1Aacknowledgefrom masterdata from portDATA 4NAPSTOPconditionSTART conditionread fromportth(D)data intoportDATA 1DATA 2DATA 3tsu(D)DATA 4002aad270Remark:This ﬁgure assumes the command byte has previously been programmed with 00h.Fig 13.Read input port registerPCA9550_5© NXP B.V. 2008. All rights reserved.

Product data sheetRev. 05 — 13 October 200810 of 26

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PCA9550

2-bit I2C-bus LED driver with programmable blink rates

8.Application design-in information

5 V5 V10 kΩ10 kΩ10 kΩI2C-BUS/SMBusMASTERSDASCLVDDPCA9550SDASCLLED0LED1RESETA0VSS002aad271Fig 14.Typical application8.1Minimizing IDD when the I/Os are used to control LEDs

When the I/Os are used to control LEDs, they are normally connected to VDD through aresistor as shown inFigure14. Since the LED acts as a diode, when the LED is off theI/OVI is about 1.2V less than VDD. The supply current, IDD, increases as VI becomeslower than VDD.

Designs needing to minimize current consumption, such as battery power applications,shouldconsidermaintainingtheI/OpinsgreaterthanorequaltoVDDwhentheLEDisoff.Figure15 shows a high value resistor in parallel with the LED.Figure16 shows VDD lessthan the LED supply voltage by at least 1.2V. Both of these methods maintain the I/OVIat or above VDD and prevents additional supply current consumption when the LED is off.

Product data sheetRev. 05 — 13 October 200811 of 26

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PCA9550

2-bit I2C-bus LED driver with programmable blink rates

8.2Programming example

The following example will show how to set LED0 to blink at 1Hz at a 50% duty cycle.LED1 will be set to blink at 4Hz and at a 25% duty cycle.

Table 11.START

PCA9550 address with A0=LOWPSC0 subaddress + Auto-Increment

Set prescaler PSC0 to achieve a period of 1second:PSC0+1

Blinkperiod=1=-----------------------44PSC0=43

Set PWM0 duty cycle to 50%:256–PWM0

--------------------------------=0.5

256PWM0=128

Set prescaler PSC1 to achieve a period of 0.25 seconds:PSC1+1

Blinkperiod=0.25=-----------------------44PSC1=10

Set PWM1 output duty cycle to 25%:256–PWM1

--------------------------------=0.25

256PWM1=192

Set LED0 to PWM0, and set LED1 to blink at PWM1STOP

0EhPC0h0Ah80h

Programming PCA9550

I2C-busSC0h11h2Bh

Program sequence9.Limiting values

Table 12.Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).SymbolVDDVI/OIO(LEDn)ISSPtotTstgTamb

Parametersupply voltagevoltage on an input/output pinoutput current on pin LEDnground supply currenttotal power dissipationstorage temperatureambient temperature

operatingConditionsMin−0.5VSS−0.5---−65−40

Max+6.05.5±2550400+150+85

UnitVVmAmAmW°C°C

Product data sheetRev. 05 — 13 October 200812 of 26

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PCA9550

2-bit I2C-bus LED driver with programmable blink rates

10.Static characteristics

Table 13.Static characteristics

VDD=2.3V to 5.5V; VSS=0V; Tamb=−40°C to +85°C; unless otherwise speciﬁed.SymbolSuppliesVDDIDDIstbVPORVILVIHIOLILCiI/OsVILVIHIOL

LOW-level input voltageHIGH-level input voltageLOW-level output current

VOL=0.4VVDD=2.3VVDD=3.0VVDD=5.0VVOL=0.7VVDD=2.3VVDD=3.0VVDD=5.0V

ILICioVILVIHILICi

[1][2][3]

[3][3][3][3][3][3]

Parametersupply voltagesupply currentstandby currentpower-on reset voltageLOW-level input voltageHIGH-level input voltageLOW-level output currentleakage currentinput capacitance

ConditionsMin2.3

Typ[1]-3501.91.7--6.5-3.7--91114141824-2.1---2.3

Max5.55003.02.2+0.3VDD5.5-+15+0.85.5------+15+0.85.5+15

UnitVµAµAVVVmAµApFVVmAmAmAmAmAmAµApFVVµApF

operating mode; VDD=5.5V; noload;VI=VDD or VSS; fSCL=100kHzStandby mode; VDD=5.5V; noload;VI=VDDorVSS; fSCL=0kHzno load; VI=VDD or VSS

[2]

--1.4−0.50.7VDD

Input SCL; input/output SDA

VOL=0.4VVI=VDD=VSSVI=VSS

3−1-−0.52.06810111417−1-−0.52.0−1

input leakage currentinput/output capacitanceLOW-level input voltageHIGH-level input voltageinput leakage currentinput capacitance

VDD=3.6V; VI=0V or VDD

Select inputs A0;RESETVI=VSS

Typical limits at VDD=3.3V, Tamb=25°C.

VDD must be lowered to 0.2V in order to reset part.

Each I/O must be externally limited to a maximum of 25mA and the device must be limited to a maximum current of 50mA.

Product data sheetRev. 05 — 13 October 200813 of 26

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2-bit I2C-bus LED driver with programmable blink rates

20 %percentvariation0 %002aac191(1)20 %percentvariation002aac192(1)(2)0 %(2)−20 %(3)−20 %(3)−40 %−40−20020406010080Tamb (°C)−40 %−40−20020406010080Tamb (°C)(1)maximum(2)average(3)minimum(1)maximum(2)average(3)minimumFig 17.Typical frequency variation over process atVDD=2.3V to 3.0VFig 18.Typical frequency variation over process atVDD=3.0V to 5.5VPCA9550_5© NXP B.V. 2008. All rights reserved.

Product data sheetRev. 05 — 13 October 200814 of 26

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2-bit I2C-bus LED driver with programmable blink rates

11.Dynamic characteristics

Table 14.SymbolDynamic characteristicsParameterConditionsStandard-modeI2C-busMinfSCLtBUFtHD;STAtSU;STAtSU;STOtHD;DATtVD;ACKtVD;DATtSU;DATtLOWtHIGHtrtftSP

Port timingtv(Q)tsu(D)th(D)Resettw(rst)trec(rst)trst

[1][2][3][4][5]

Fast-mode I2C-busMin01.30.60.60.60---1001.30.620+0.1Cb[3]20+0.1Cb[3]

-Max400-----600600600---30030050

UnitMax100-----6006001500---100030050

SCL clock frequency

bus free time between a STOP andSTART condition

hold time (repeated) START conditionset-up time for a repeated STARTcondition

set-up time for STOP conditiondata hold time

data valid acknowledge timedata valid timedata set-up time

LOW period of the SCL clockHIGH period of the SCL clockrise time of both SDA and SCL signalsfall time of both SDA and SCL signalspulse width of spikes that must besuppressed by the input ﬁlterdata output valid timedata input set-up timedata input hold timereset pulse widthreset recovery timereset time

[4][5][1]

04.74.04.74.00---2504.74.0---LOW-levelHIGH-level

[2][2]

kHzµsµsµsµsnsnsnsnsnsµsµsnsnsns

-100160400

200-----

-100160400

200-----

nsnsµsnsnsns

tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW.tVD;DAT = minimum time for SDA data output to be valid following SCL LOW.Cb=total capacitance of one bus line in pF.

Resetting the device while actively communicating on the bus may cause glitches or errant STOP conditions.Upon reset, the full delay will be the sum of trst and the RC time constant of the SDA bus.

Product data sheetRev. 05 — 13 October 200815 of 26

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2-bit I2C-bus LED driver with programmable blink rates

STARTSCLACK or read cycleSDA30 %trstRESET50 %trec(rst)50 %tw(rst)50 %trstLEDn50 %LED off002aac193Fig 19.Deﬁnition ofRESET timingSDAtBUFtLOWSCLtrtftHD;STAtSPtHD;STAPStHD;DATtHIGHtSU;DATtSU;STASrtSU;STOP002aaa986Fig 20.Deﬁnition of timingPCA9550_5© NXP B.V. 2008. All rights reserved.

Product data sheetRev. 05 — 13 October 200816 of 26

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PCA9550

2-bit I2C-bus LED driver with programmable blink rates

protocolSTARTcondition(S)tSU;STAbit 7MSB(A7)tLOWtHIGHbit 6(A6)bit 0(R/W)acknowledge(A)STOPcondition(P)1/fSCLSCLtBUFSDAtrtftHD;STAtSU;DATtHD;DATtVD;DATtVD;ACKtSU;STO002aab175Rise and fall times refer to VIL and VIH.Fig 21.I2C-bus timing diagram12.Test information

VDDopenVSSVDDPULSEGENERATORVIDUTRTVORL500 ΩCL50 pF002aab880RL = load resistor for LEDn. RL for SDA and SCL > 1kΩ (3mA or less current).CL = load capacitance includes jig and probe capacitance.RT = termination resistance should be equal to the output impedance Zo of the pulse generators.Fig 22.Test circuitry for switching timesPCA9550_5© NXP B.V. 2008. All rights reserved.

Product data sheetRev. 05 — 13 October 200817 of 26

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2-bit I2C-bus LED driver with programmable blink rates

13.Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

DEAXcyHEvMAZ85QA2pin 1 indexθLp1ebp4wMLdetail XA1(A )3A02.5scale5 mmDIMENSIONS (inch dimensions are derived from the original mm dimensions)UNITmminchesAmax.1.750.069A10.250.10A21.451.25A30.250.01bp0.490.36c0.250.19D(1)5.04.80.200.19E(2)4.03.80.160.15e1.270.05HE6.25.8L1.05Lp1.00.4Q0.70.6v0.250.01w0.250.01y0.10.004Z(1)0.70.30.0280.012θ8oo00.0100.0570.0040.0490.0190.01000.0140.00750.2440.0390.0280.0410.2280.0160.024Notes1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINEVERSION SOT96-1 REFERENCES IEC076E03 JEDEC MS-012 JEITAEUROPEANPROJECTIONISSUE DATE99-12-2703-02-18Fig 23.Package outline SOT96-1 (SO8)

PCA9550_5

Product data sheetRev. 05 — 13 October 200818 of 26

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PCA9550

2-bit I2C-bus LED driver with programmable blink rates

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mmSOT505-1

DEAXcyHEvMAZ85A2pin 1 indexA1(A3)AθLpL1ebp4detail XwM02.5scale5 mmDIMENSIONS (mm are the original dimensions)UNITmmAmax.1.1A10.150.05A20.950.80A30.25bp0.450.25c0.280.15D(1)3.12.9E(2)3.12.9e0.65HE5.14.7L0.94Lp0.70.4v0.1w0.1y0.1Z(1)0.700.35θ6°0°Notes1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.OUTLINEVERSION SOT505-1 REFERENCES IEC JEDEC JEITAEUROPEANPROJECTIONISSUE DATE99-04-0903-02-18Fig 24.Package outline SOT505-1 (TSSOP8)

PCA9550_5

Product data sheetRev. 05 — 13 October 200819 of 26

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2-bit I2C-bus LED driver with programmable blink rates

HVSON8: plastic thermal enhanced very thin small outline package; no leads;8 terminals; body 3 x 3 x 0.85 mm

SOT908-1

01scale2 mmXDBAEAA1cdetail Xterminal 1index areaterminal 1index area1e1eb4 v wMMCABCCy1Cyexposed tie bar (4×)LEhexposed tie bar (4×)85DhDIMENSIONS (mm are the original dimensions)UNITmmA(1)max.1A10.050.00b0.30.2c0.2D(1)3.12.9Dh2.251.95E(1)3.12.9Eh1.651.35e0.5e11.5L0.50.3v0.1w0.05y0.05y10.1Note1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINEVERSION SOT908-1 REFERENCES IEC JEDECMO-229JEITAEUROPEANPROJECTIONISSUE DATE05-09-2605-10-05Fig 25.Package outline SOT908-1 (HVSON8)

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14.Handling information

Inputs and outputs are protected against electrostatic discharge in normal handling.

However,tobecompletelysafeyoumusttakenormalprecautionsappropriatetohandlingintegrated circuits.

15.Soldering of SMD packages

Thistextprovidesaverybriefinsightintoacomplextechnology.Amorein-depthaccountof soldering ICs can be found in Application NoteAN10365 “Surface mount reﬂowsoldering description”.

15.1Introduction to soldering

Soldering is one of the most common methods through which packages are attached toPrintedCircuitBoards(PCBs),toformelectricalcircuits.Thesolderedjointprovidesboththe mechanical and the electrical connection. There is no single soldering method that isideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is notsuitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and highdensities that come with increased miniaturization.

15.2Wave and reﬂow soldering

Wavesolderingisajoiningtechnologyinwhichthejointsaremadebysoldercomingfroma standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadlesspackages which have solder lands underneath the body, cannot be wave soldered. Also,leaded SMDs with leads having a pitch smaller than ~0.6mm cannot be wave soldered,due to an increased probability of bridging.

The reﬂow soldering process involves applying solder paste to a board, followed bycomponent placement and exposure to a temperature proﬁle. Leaded packages,packages with solder balls, and leadless packages are all reﬂow solderable.Key characteristics in both wave and reﬂow soldering are:

••••••

Board speciﬁcations, including the board ﬁnish, solder masks and viasPackage footprints, including solder thieves and orientationThe moisture sensitivity level of the packagesPackage placementInspection and repair

Lead-free soldering versus SnPb soldering

15.3Wave soldering

Key characteristics in wave soldering are:

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•Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components areexposed to the wave

•Solder bath speciﬁcations, including temperature and impurities

15.4Reﬂow soldering

Key characteristics in reﬂow soldering are:

•Lead-freeversusSnPbsoldering;notethatalead-freereﬂowprocessusuallyleadsto

higher minimum peak temperatures (seeFigure26) than a SnPb process, thusreducing the process window

•Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperatureishighenoughforthesoldertomakereliablesolderjoints(asolderpastecharacteristic). In addition, the peak temperature must be low enough that thepackages and/or boards are not damaged. The peak temperature of the packagedepends on package thickness and volume and is classiﬁed in accordance withTable15 and16

Table 15.

SnPb eutectic process (from J-STD-020C)

Package reﬂow temperature (°C)Volume (mm3)< 350< 2.5≥ 2.5Table 16.

235220

Lead-free process (from J-STD-020C)

Package reﬂow temperature (°C)Volume (mm3)< 350< 1.61.6 to 2.5> 2.5

260260250

350 to 2000260250245

> 2000260245245

≥ 350220220

Package thickness (mm)Package thickness (mm)Moisture sensitivity precautions, as indicated on the packing, must be respected at alltimes.

Studies have shown that small packages reach higher temperatures during reﬂowsoldering, seeFigure26.

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temperaturemaximum peak temperature= MSL limit, damage levelminimum peak temperature= minimum soldering temperaturepeak temperaturetime001aac844MSL: Moisture Sensitivity LevelFig 26.Temperature proﬁles for large and small componentsFor further information on temperature proﬁles, refer to Application NoteAN10365“Surface mount reﬂow soldering description”.

16.Abbreviations

Table 17.AcronymAICDMDSPDUTESDGPIOHBMI2C-busI/OICLEDMCUMMMPUPORPWMRCSMBus

Abbreviations

DescriptionAuto-IncrementCharged Device ModelDigital Signal ProcessorDevice Under TestElectroStatic DischargeGeneral Purpose Input/OutputHuman Body ModelInter IC busInput/OutputIntegrated CircuitLight Emitting DiodeMicroController UnitMachine ModelMicroProcessor UnitPower-On ResetPulse Width ModulationResistor-Capacitor networkSystem Management Bus

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17.Revision history

Table 18.

Revision history

Release date20081013

Data sheet statusProduct data sheet

Change notice-SupersedesPCA9550_4

Document IDPCA9550_5Modiﬁcations:

•

Section 8.1 “Minimizing IDD when the I/Os are used to control LEDs”, 1st paragraph,

3rdsentence changed from “The supply current, IDD, increases as VI becomes lower thanVDDandisspeciﬁedas∆IDDinTable13“Staticcharacteristics”.”to“Thesupplycurrent,IDD,increases as VI becomes lower than VDD.”

Table 13 “Static characteristics”, sub-section “Supplies”: removed∆IDD characteristicTable 13 “Static characteristics”, sub-section “I/Os”, symbol IOL, LOW-level output current:–condition VOL=0.4V; VDD=2.3V: changed Min value from “9mA” to “6mA”;changedTyp value from “-” to “9mA”–condition VOL=0.4V; VDD=3.0V: changed Min value from “11mA” to “8mA”;changedTyp value from “-” to “11mA”–condition VOL=0.4V; VDD=5.0V: changed Min value from “14mA” to “10mA”;changedTyp value from “-” to “14mA”–condition VOL=0.7V; VDD=2.3V: changed Min value from “14mA” to “11mA”;changedTyp value from “-” to “14mA”–condition VOL=0.7V; VDD=3.0V: changed Min value from “18mA” to “14mA”;changedTyp value from “-” to “18mA”–condition VOL=0.7V; VDD=5.0V: changed Min value from “24mA” to “17mA”;changedTyp value from “-” to “24mA”

••

•

PCA9550_4PCA9550_3

(939775013719)PCA9550_2

(939775011461)PCA9550_1

(939775010857)

updated soldering information

Product data sheetProduct data sheetProduct dataProduct data

--PCA9550_3PCA9550_2

20080107200410012003050220021213

ECN853-239629859ofPCA9550_124Apr2003

ECN853-2396292of-09Dec2002

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18.Legal information

18.1Data sheet status

Document status[1][2]Objective [short] data sheetPreliminary [short] data sheetProduct [short] data sheet

[1][2][3]

Product status[3]DevelopmentQualiﬁcationProduction

DeﬁnitionThis document contains data from the objective speciﬁcation for product development.This document contains data from the preliminary speciﬁcation.This document contains the product speciﬁcation.

Please consult the most recently issued document before initiating or completing a design.The term ‘short data sheet’ is explained in section “Deﬁnitions”.

Theproductstatusofdevice(s)describedinthisdocumentmayhavechangedsincethisdocumentwaspublishedandmaydifferincaseofmultipledevices.Thelatestproductstatusinformation is available on the Internet at URLhttp://www.nxp.com.

18.2Deﬁnitions

Draft —The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodiﬁcations or additions. NXP Semiconductors does not give anyrepresentations or warranties as to the accuracy or completeness of

informationincludedhereinandshallhavenoliabilityfortheconsequencesofuse of such information.

Short data sheet —A short data sheet is an extract from a full data sheetwiththesameproducttypenumber(s)andtitle.Ashortdatasheetisintendedforquickreferenceonlyandshouldnotbereliedupontocontaindetailedandfull information. For detailed and full information see the relevant full datasheet, which is available on request via the local NXP Semiconductors salesofﬁce. In case of any inconsistency or conﬂict with the short data sheet, thefull data sheet shall prevail.

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use ofNXP Semiconductors products in such equipment or applications andtherefore such inclusion and/or use is at the customer’s own risk.

Applications —Applications that are described herein for any of theseproducts are for illustrative purposes only. NXP Semiconductors makes norepresentation or warranty that such applications will be suitable for thespeciﬁed use without further testing or modiﬁcation.

Limiting values —Stress above one or more limiting values (as deﬁned intheAbsoluteMaximumRatingsSystemofIEC60134)maycausepermanentdamagetothedevice.Limitingvaluesarestressratingsonlyandoperationofthe device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limitingvalues for extended periods may affect device reliability.

Terms and conditions of sale —NXP Semiconductors products are soldsubjecttothegeneraltermsandconditionsofcommercialsale,aspublishedathttp://www.nxp.com/proﬁle/terms, including those pertaining to warranty,intellectual property rights infringement and limitation of liability, unlessexplicitly otherwise agreed to in writing by NXP Semiconductors. In case ofany inconsistency or conﬂict between information in this document and suchterms and conditions, the latter will prevail.

No offer to sell or license —Nothing in this document may be interpretedor construed as an offer to sell products that is open for acceptance or thegrant,conveyanceorimplicationofanylicenseunderanycopyrights,patentsor other industrial or intellectual property rights.

18.3Disclaimers

General —Information in this document is believed to be accurate and

reliable.However,NXPSemiconductorsdoesnotgiveanyrepresentationsorwarranties,expressedorimplied,astotheaccuracyorcompletenessofsuchinformation and shall have no liability for the consequences of use of suchinformation.

Right to make changes —NXPSemiconductorsreservestherighttomakechanges to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and withoutnotice.Thisdocumentsupersedesandreplacesallinformationsuppliedpriorto the publication hereof.

Suitability for use —NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in medical, military, aircraft,space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

18.4Trademarks

Notice:Allreferencedbrands,productnames,servicenamesandtrademarksare the property of their respective owners.I2C-bus —logois a trademark of NXP B.V.

19.Contact information

For more information, please visit:http://www.nxp.com

For sales ofﬁce addresses, please send an email to:salesaddresses@nxp.com

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20.Contents

1General description. . . . . . . . . . . . . . . . . . . . . . 12Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Ordering information. . . . . . . . . . . . . . . . . . . . . 23.1Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 24Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 25Pinning information. . . . . . . . . . . . . . . . . . . . . . 35.1Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35.2Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 36Functional description . . . . . . . . . . . . . . . . . . . 46.1Device address. . . . . . . . . . . . . . . . . . . . . . . . . 46.2Control register. . . . . . . . . . . . . . . . . . . . . . . . . 46.2.1Control register deﬁnition . . . . . . . . . . . . . . . . . 56.3Register descriptions . . . . . . . . . . . . . . . . . . . . 56.3.1INPUT - Input register. . . . . . . . . . . . . . . . . . . . 56.3.2PSC0 - Frequency Prescaler0. . . . . . . . . . . . . 56.3.3PWM0 - Pulse Width Modulation0. . . . . . . . . . 56.3.4PSC1 - Frequency Prescaler1. . . . . . . . . . . . . 66.3.5PWM1 - Pulse Width Modulation1. . . . . . . . . . 66.3.6LS0 - LED selector . . . . . . . . . . . . . . . . . . . . . . 66.4Pins used as GPIOs. . . . . . . . . . . . . . . . . . . . . 76.5Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 76.6ExternalRESET. . . . . . . . . . . . . . . . . . . . . . . . 77Characteristics of the I2C-bus. . . . . . . . . . . . . . 87.1Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87.1.1START and STOP conditions . . . . . . . . . . . . . . 87.2System conﬁguration . . . . . . . . . . . . . . . . . . . . 87.3Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . 97.4Bus transactions. . . . . . . . . . . . . . . . . . . . . . . 108Application design-in information . . . . . . . . . 118.1Minimizing IDD when the I/Os are used

to control LEDs. . . . . . . . . . . . . . . . . . . . . . . . 118.2Programming example . . . . . . . . . . . . . . . . . . 129Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 1210Static characteristics. . . . . . . . . . . . . . . . . . . . 1311Dynamic characteristics . . . . . . . . . . . . . . . . . 1512Test information. . . . . . . . . . . . . . . . . . . . . . . . 1713Package outline . . . . . . . . . . . . . . . . . . . . . . . . 1814Handling information. . . . . . . . . . . . . . . . . . . . 2115Soldering of SMD packages . . . . . . . . . . . . . . 2115.1Introduction to soldering. . . . . . . . . . . . . . . . . 2115.2Wave and reﬂow soldering . . . . . . . . . . . . . . . 2115.3Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 2115.4Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . . 2216Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 2317

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24

18Legal information . . . . . . . . . . . . . . . . . . . . . . 2518.1Data sheet status. . . . . . . . . . . . . . . . . . . . . . 2518.2Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 2518.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 2518.4Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 2519Contact information . . . . . . . . . . . . . . . . . . . . 2520

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Pleasebeawarethatimportantnoticesconcerningthisdocumentandtheproduct(s)described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 13 October 2008Document identifier: PCA9550_5

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