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专利名称：Chip package mounting structure for
controlling warp of electronic assembliesdue to thermal expansion effects
发明人：Mark F. Sylvester申请号：US09/040847申请日：19980318公开号：US06014317A公开日：20000111
摘要：A chip package is provided for controlling warp of electronic assemblies. Thechip package has a first component mounted on one side of a substrate. The substrate isa multi-layered laminate having a plurality of dielectric layers made of an organicmaterial. The first component has a different coefficient of thermal expansion (CTE) thanthe substrate. The chip package includes a second component mounted on an oppositeside of the substrate in a location substantially opposite the first component. The secondcomponent has a CTE that approximately matches the CTE of the first component. Thesecond component tends to generate bending moments that offset distorting bendingmoments that may otherwise exist in the chip package without the second component.
申请人：W. L. GORE & ASSOCIATES, INC.
代理人：Victor M. Genco, Jr.
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