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专利名称：Alignment method and apparatus发明人：Nobutaka Magome,Kazuya Ohta,Hiroki
Tateno
申请号：US07/545760申请日：19900628公开号：US05754300A公开日：19980519
摘要：An error in alignment between both positions is obtained from referenceposition information incorporated in advance in an exposure apparatus for manufacturinga semiconductor and detection position information obtained by physically non-contactmeasuring a mark formed on an object to be measured such as a wafer, a mask or a waferstage. This mark has a construction having a periodic pattern at a predetermined pitch inconnection with a scanning direction. A periodic signal obtained by non-contact scanningthe mark is subjected to Fourier integration processing and a phase angle including notonly a fundamental wave component but a high-order component by calculation of a sinewave and a cosine component of Fourier conversion to thereby detect positioninformation of an average center position of the mark with a correction of a markdeformation caused by wafer or process of mask added thereto. An error in alignment iscorrected by relatively moving said object to a reference position.
申请人：MAGOME; NOBUTAKA,OHTA; KAZUYA,TATENO; HIROKI
代理人：Michael N. Meller
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