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专利名称：Prelamination, imagewise exposure of
photohardenable layer in process forsensitizing, registering and exposing circuitboards
申请号：US47949483申请日：19830328公开号：US4528261B1公开日：19881115
摘要：Actinic radiation exposes photohardenable material in two steps wherebyphotohardenable material not present as a solid is exposed through a photomask priorto application to a substrate and in a second step is reexposed through the photomaskafter application of the material to the substrate.
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