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专利名称：CAPILLARY-FLOW UNDERFILL
COMPOSITIONS, PACKAGES CONTAININGSAME, AND SYSTEMS CONTAINING SAME
发明人：Rahul N. Manepalli,Saikumar Jayaraman申请号：US13113960申请日：20110523
公开号：US20110223722A1公开日：20110915
专利附图：
摘要：An underfill composition is formulated to increase the surface tension thereoffor use in capillary underfilling of an integrated circuit die that is coupled to a mounting
substrate. A method includes mixing a surface tension-increasing additive with a bulkpolymer and a hardener and allowing the underfill composition to flow between theintegrated circuit die and the mounting substrate. An article is achieved by the method.The article can be assembled into a computing system.
申请人：Rahul N. Manepalli,Saikumar Jayaraman
地址：Chandler AZ US,Chandler AZ US
国籍：US,US
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