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Device for applying adhesive spots on a substrate

来源:华佗小知识
专利内容由知识产权出版社提供

专利名称:Device for applying adhesive spots on a

substrate

发明人:Manfred Lehmann申请号:US09/160431申请日:19980924公开号:US06123771A公开日:20000926

摘要:A device for simultaneous application of a plurality of adhesive spot s to asubstrate, having a metering apparatus for conveying a predetermined volume ofadhesive to a plurality of applicator nozzles for the application of respectively oneadhesive spot to the substrate. A distribution apparatus distributes the volume ofadhesive conveyed by the metering, device to the applicator nozzles. A warming mediumis heated in a warning apparatus for heating the adhesive to a temperature desired formanipulation. The metering apparatus and the distribution apparatus are connected witheach other by a conveying line containing an adhesive conduit. Feed lines with adhesiveconduits lead from the distribution apparatus to the applicator nozzles, wherein a closedloop of the warming medium is formed, starting at the warming apparatus, and routed viathe distribution apparatus and the feed lines to the applicator nozzles, and is returnedvia the feed lines and the distribution apparatus to the warming apparatus.

申请人:INTEC BIELENBERG GMBH & CO. KG

代理机构:Pauley Peterson Kinne & Fejer

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